ROHM Semiconductor has expanded its silicon carbide (SiC) power module portfolio with the introduction of the DOT-247 package 2-in-1 SiC modules, designed to meet the growing demand for compact, high-efficiency solutions in power electronics. The SCZ400xDTx and SCZ40xxKTx series SiC power modules are housed in the newly developed 2-in-1 “DOT-247” molded module which joins two discrete TO-247 packages, enabling a high power density. Ideal for industrial applications such as PV inverters, UPS systems, and semiconductor relays, the module retains the versatility of the widely adopted "TO-247" package while achieving high design flexibility and power density. The integration of two SiC MOSFETs into a single DOT-247 package, offers significant space savings and simplified thermal management.
Available in 750V (SCZ400xDTx) and 1200V (SCZ40xxKTx) ratings, the modules are available with a choice of RDS (on) as low as 4 mΩ and ID ratings up to 251A in a choice of Half Bridge or Common Source circuit configurations.
The DOT-247 package features a combined structure consisting of two TO-247 packages, this design has enabled ROHM to use larger chips which were structurally difficult to accommodate in the TO-247 package and achieves low on-resistance through a unique internal structure.
DOT-247 Power Density vs. TO-247
The new products featuring the DOT-247 package are available in two topologies: half-bridge and common-source. Currently, two-level inverters are the mainstream in PV inverters, but there is growing demand for multi-level circuits such as three-level NPC, three-level T-NPC, and five-level ANPC to meet the need for higher voltages. In the switching sections of these circuits, topologies such as half-bridge and common-source are mixed –making custom products necessary in many cases when using conventional SiC modules.
To address this challenge, ROHM has developed each of these two topologies—the smallest building blocks of multi-level circuits—into a 2-in-1 module. This enables flexibility to support various configurations such as NPC circuits and DC-DC converters, while significantly reducing the number of components and mounting area, and achieving circuit miniaturization compared to discrete components.
Circuit Configurations
Through the optimized package structure of the DOT-247 package, thermal resistance has also been reduced by approximately 15% and inductance by approximately 50% compared to the TO-247. This enables a power density 2.3 times higher than the TO-247 in a half-bridge configuration –achieving the same power conversion circuit in approximately half the volume.
Thermal Resistance and Stray Inductance performance
The SCZ400xDTx and SCZ40xxKTx series DOT-247 SiC power modules with 2-in-1 configuration are ideal for a range of applications including industrial equipment, PV inverters, UPS systems, EV chargers and semiconductor relays.
EcoSiC™ is a brand of devices that utilize silicon carbide (SiC), these devices deliver performance that surpasses silicon (Si). ROHM independently develops technologies essential for the evolution of SiC, from wafer fabrication and production processes to packaging, and quality control methods. At the same time, ROHM have established an integrated production system throughout the manufacturing process, solidifying their position as a leading SiC supplier. EcoSiC™ is a trademark of ROHM Co., Ltd.
The SCZ400xDTx and SCZ40xxKTx series DOT-247 modules complement ROHM’s broader SiC lineup, leveraging ROHM’s proprietary SiC technology, these modules deliver low on-resistance, high switching speeds, and robust performance across a wide temperature range. Whether you're designing for industrial drives or next-gen EV infrastructure, ROHM’s 2-in-1 SiC modules offer a compelling solution for engineers pushing the boundaries of power conversion
Anglia are offering customers a FREE evaluation kit and samples of the SCZ400xDTx and SCZ40xxKTx series DOT-247 2-in-1 SiC power modules from ROHM, please fill in the form below to register your interest now.
Free samples are subject to availability.
The STM32WBA wireless microcontroller family from STMicroelectronics brings designers the performance, efficiency, and security required for Bluetooth® Low Energy enabled applications.
Looking for a reliable way to monitor liquid levels in your next design? The Sensata Cynergy3 RSF Series float switches provide dependable point-level detection for water, fuels, chemicals, oils and other liquids, helping engineers improve system safety while reducing maintenance and downtime.
The HIROSE BM54 series floating board‑to‑board connector is designed to absorb real‑world tolerances without sacrificing density.
As embedded systems continue to evolve, designers are increasingly challenged to deliver higher performance, stronger security, and longer battery life within increasingly compact products. Whether developing industrial sensors, smart building controls, healthcare devices, or connected IoT endpoints, selecting the right microcontroller is critical to achieving design goals. The latest STM32U3 microcontroller families from STMicroelectronics have been developed to address these challenges, combining modern processing capability with an energy-conscious architecture.
In today’s fast moving electronics world, robust circuit protection is essential for ensuring long-term reliability and safety. Taiwan Semiconductor’s latest snapback (Super Clamp) TVS technology incorporated into the LTD7S24CAH device marks a significant step forward in protecting sensitive circuits from transient voltage events.
STMicroelectronics have introduced the L6986I device, a high-performance synchronous buck converter that is designed for use in applications that require isolated power conversion.
HARTING has launched the new D-Sub PushPull housings. Designed to improve efficient and process-safe handling, the HARTING D-Sub PushPull transforms a well-known connector family into a simplified solution. The PushPull locking mechanism significantly improves the assembly process and reduces installation and maintenance time by up to 50%.