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MITSUBISHI / PCNs & PTNs
Part No.

PCNs (Product Change Notifications)

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Part No: MGF2445A-01
PCN Number: PCN-H-02-07
Description: Change the packing style for the MGF24xxA series
Date of Issue: 18/07/2007 00:00:00
PCN1PCN2
Part No: MGF2445A-01
PCN Number: PCN-H-03-07
Description: Marking Style Change
Date of Issue: 20/07/2007 00:00:00
PCN1PCN2
Part No: RA01L8693MA-101
PCN Number: H-02-08
Description: Process Change - Ink to Laser
Date of Issue: 17/03/2008 00:00:00
PCN1PCN2
Part No: RA03M3540MD-101
PCN Number: H-02-08
Description: Process Change - Ink to Laser
Date of Issue: 17/03/2008 00:00:00
PCN1PCN2
Part No: RA03M4043MD-101
PCN Number: H-02-08
Description: Process Change - Ink to Laser
Date of Issue: 17/03/2008 00:00:00
PCN1PCN2
Part No: RA03M8087M-101
PCN Number: H-02-08
Description: Process Change - Ink to Laser
Date of Issue: 17/03/2008 00:00:00
PCN1PCN2
Part No: RA03M9595M-101
PCN Number: H-02-08
Description: Process Change - Ink to Laser
Date of Issue: 17/03/2008 00:00:00
PCN1PCN2
Part No: RA05H9595M-101
PCN Number: H-02-08
Description: Process Change - Ink to Laser
Date of Issue: 17/03/2008 00:00:00
PCN1PCN2
Part No: RA06H8285M-101
PCN Number: H-02-08
Description: Process Change - Ink to Laser
Date of Issue: 17/03/2008 00:00:00
PCN1PCN2
Part No: RA07H3340M-101
PCN Number: H-02-08
Description: Process Change - Ink to Laser
Date of Issue: 17/03/2008 00:00:00
PCN1PCN2
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PTNs (Product Termination Notifications)

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Part No: RA01L8693MA-101
PTN Number: PDN-H-03-12
Description: HF-Device Discontinuation
Date of Issue: 19/09/2012 00:00:00
PTN1
Part No: RD02MUS1-101
PTN Number: PCN-H-02-13
Description: Change of die attach, lead-frame plating, production site and package thickness
Date of Issue: 09/05/2013 00:00:00
PTN1PTN2
Part No: RD07MUS2B-101
PTN Number: PCN-H-02-13
Description: Change of die attach, lead-frame plating, production site and package thickness
Date of Issue: 09/05/2013 00:00:00
PTN1PTN2
Part No: RD07MVS1-101
PTN Number: PCN-H-02-13
Description: Change of die attach, lead-frame plating, production site and package thickness
Date of Issue: 09/05/2013 00:00:00
PTN1PTN2
Part No: RD12MVS1-T112
PTN Number: PCN-H-02-13
Description: Change of die attach, lead-frame plating, production site and package thickness
Date of Issue: 09/05/2013 00:00:00
PTN1PTN2
Part No: RD12MVS1-101
PTN Number: PCN-H-02-13
Description: Change of die attach, lead-frame plating, production site and package thickness
Date of Issue: 09/05/2013 00:00:00
PTN1PTN2
Part No: MGF0904A-01
PTN Number: PDN-H-02-15
Description: High power GaAs FET Discontinuation
Date of Issue: 09/03/2016 00:00:00
PTN1
Part No: MGF0906B-01
PTN Number: PDN-H-02-15
Description: High power GaAs FET Discontinuation
Date of Issue: 09/03/2016 00:00:00
PTN1
Part No: MGF0907B-01
PTN Number: PDN-H-02-15
Description: High power GaAs FET Discontinuation
Date of Issue: 09/03/2016 00:00:00
PTN1
Part No: MGF0911A-01
PTN Number: PDN-H-02-15
Description: High power GaAs FET Discontinuation
Date of Issue: 09/03/2016 00:00:00
PTN1
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