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AD9837ACPZ-RL7

ANALOG DEVICES

LOW COST DDS IC.

AD9837ACPZ-RL7
Image is for illustrative purposes only. Please refer to product data sheet.

Availability

Stock 0
Reserved Stock 0
Stock Due Date Date next shipment is due, this may not be for the full quantity shown below -
Total Stock Due 0
Total Reserved Stock Due 0
Supplier Lead Time (wk) 10
Standard Pack Qty non-stocked items may be subject to a higher supplier minimum order quantity 1500
Minimum Order Qty non-stocked items may be subject to a higher supplier minimum order quantity 1
Order Multiple 1
Package Type: Tape & Reel
Moisture Sensitive
Tariff Code: 8542399000
ECCN: NLR
CoO: China

Specification

BrandANALOG DEVICES
Case or Package TypeLFCSP-WD10
Clock Frequency5 MHz
Mounting TypeSurface Mount
Operating Temperature-40°C to +125°C
Resolution10 bit
Supply Voltage2.3V to 5.5V
Tuning Word28 bit
The specification data is supplied for search purposes only. Please refer to the product data sheet for full technical details

PCN PTN

PCN (Product Change Notification)
PCN Number: PCN 13_0223
Description: Assembly & Test transfer ofsSelect 2x3 and 3x3mm LFCSP Products to STATS ChipPAC China
Date of Issue: 18/10/2013 00:00:00
PCN1PCN2
PCN Number: AD_PCN 13_0223 Rev. B
Description: Remove parts & Include Qualification and Test Correlation Report Summary.
Date of Issue: 28/04/2014 00:00:00
PCN1PCN2
PCN Number: ad_PCN 13_0223 Rev. C
Description: Assembly and Test Transfer of Select 2x3mm and 3x3mm LFCSP Products to STATS ChipPAC China
Date of Issue: 06/08/2014 00:00:00
PCN1PCN2
PCN Number: ad_PCN 16_0036
Description: Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore of Select LFCSP Products
Date of Issue: 11/02/2016 00:00:00
PCN1PCN2
PCN Number: ad_PCN 16_0036 Rev. B
Description: Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore of Select LFCSP Products
Date of Issue: 06/05/2016 00:00:00
PCN1PCN2
PCN Number: ad_PCN 16_0036 Rev. C
Description: Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore Update
Date of Issue: 31/07/2016 00:00:00
PCN1PCN2
PCN Number: ad_PCN 16_0036 Rev. D
Description: Assembly Relocation update
Date of Issue: 21/10/2016 00:00:00
PCN1PCN2
PCN Number: PCN 21_0271
Description: Qualification of an Alternate Adhesive Material and Molding Compound
Date of Issue: 08/07/2022 00:00:00
PCN1PCN2

Price (Each)

QtyPrice
1£3.30000
101£3.19000
251£3.03000
751£2.98000
1501+£2.84000

Resources

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