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ADF4153BCPZ

ANALOG DEVICES

SINGLE RF F-N PLL

ADF4153BCPZ
Image is for illustrative purposes only. Please refer to product data sheet.

Availability

Stock 0
Reserved Stock 0
Stock Due Date Date next shipment is due, this may not be for the full quantity shown below 27/05/2024
Total Stock Due 13473
Total Reserved Stock Due 0
Supplier Lead Time (wk) 2
Standard Pack Qty non-stocked items may be subject to a higher supplier minimum order quantity 490
Minimum Order Qty non-stocked items may be subject to a higher supplier minimum order quantity 1
Order Multiple 1
Package Type: Tray IC
Moisture Sensitive
High Reliability Part
Tariff Code: 8542399000
ECCN: NLR
CoO: China

Specification

BrandANALOG DEVICES
Case or Package TypeLFCSP-VQ20
Divider/MultiplierNo/Yes
Frequency4 GHz
Input:Output DifferentialYes/No
Input:Output Ratio2:1
Mounting TypeSurface Mount
No. of Circuits1
Operating Temperature-40°C to +80°C
Output TypeClk
PLLYes
Supply Voltage2.7V - 3.3V
Input TypeCMOS
The specification data is supplied for search purposes only. Please refer to the product data sheet for full technical details

PCN PTN

PCN (Product Change Notification)
PCN Number: PCN 13_0266
Description: Test Transfer of Select LFCSP Products to STATS ChipPAC China
Date of Issue: 22/11/2013 00:00:00
PCN1PCN2
PCN Number: PCN 14_0020
Description: Conversion of 4x4mm LFCSP Package Punch to Sawn & Transfer of Assembly Site
Date of Issue: 03/02/2014 00:00:00
PCN1PCN2
PCN Number: AD_PCN 14_0020 Rev. A
Description: Conversion of 4x4mm LFCSP Package Punch to Sawn and Transfer of Assembly Site to Amkor Philippines
Date of Issue: 05/05/2014 00:00:00
PCN1PCN2
PCN Number: AD_PCN 13_0231 Rev. E
Description: Assembly Transfer of LFCSP Products to STATS ChipPAC China
Date of Issue: 12/06/2014 00:00:00
PCN1PCN2
PCN Number: AD_PCN 13_0266 Rev. A
Description: Test Transfer of Select LFCSP Products to STATS ChipPAC China update
Date of Issue: 25/06/2014 00:00:00
PCN1PCN2
PCN Number: ad_PCN 16_0036
Description: Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore of Select LFCSP Products
Date of Issue: 11/02/2016 00:00:00
PCN1PCN2
PCN Number: ad_PCN 16_0036 Rev. B
Description: Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore of Select LFCSP Products
Date of Issue: 06/05/2016 00:00:00
PCN1PCN2
PCN Number: ad_PCN 16_0036 Rev. C
Description: Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore Update
Date of Issue: 31/07/2016 00:00:00
PCN1PCN2
PCN Number: ad_PCN 16_0036 Rev. D
Description: Assembly Relocation update
Date of Issue: 21/10/2016 00:00:00
PCN1PCN2
PCN Number: PCN 21_0271
Description: Qualification of an Alternate Adhesive Material and Molding Compound
Date of Issue: 08/07/2022 00:00:00
PCN1PCN2

Price (Each)

QtyPrice
1£4.91000
2£4.74000
3+£4.50000

Resources

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