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Semiconductor Discretes
/
Transistors
/
MOSFET's
DMN601K
DIODES ZETEX
MOSFET NMOS SOT23
Image is for illustrative purposes only. Please refer to product data sheet.
Availability
Stock
0
Reserved Stock
0
Stock Due Date
Date next shipment is due, this may not be for the full quantity shown below
-
Total Stock Due
0
Total Reserved Stock Due
0
Supplier Lead Time (wk)
(See Lead Time Forecast)
16
Standard Pack Qty
non-stocked items may be subject to a higher supplier minimum order quantity
3000
Minimum Order Qty
non-stocked items may be subject to a higher supplier minimum order quantity
1
Order Multiple
1
Package Type: Tape & Reel
RoHS:
Tariff Code: 8541290000
ECCN: NLR
Specification
›
Brand
DIODES ZETEX
Case or Package Type
SOT23
Continuous Drain Current
300 mA
Drain-Source Voltage
60 V
Gate-Source V(th)
2.5 V
Input Capacitance
50 pF
Mounting Type
Surface Mount
Power Dissipation
350 mW
Rds (on)
2 ohm
Type
N-Channel
The specification data is supplied for search purposes only. Please refer to the product data sheet for full technical details
PCN PTN
›
PCN (Product Change Notification)
PCN Number: 2000 rev1
Description: Additional Assembly Location AUK Dalian, China for SOT23 Package
Date of Issue: 14/07/2010 00:00:00
PCN Number: PCN_2084_RO
Description: Qualification of Additional Wafer Fabrication Sources
Date of Issue: 08/08/2012 00:00:00
PCN Number: 1133
Description: Additional Wafer Fab Sources
Date of Issue: 27/02/2009 00:00:00
PCN Number: dio_PCN-2197
Description: PCN-2197 - Qualification of "Diodes Technology (Chengdu) Company Limited" (CAT) as an Additional Plating Site
Date of Issue: 29/07/2015 00:00:00
PCN Number: PCNDIO269006
Description: Qualification of Diodes subcontractor
Date of Issue: 24/05/2024 00:00:00
PCN Number: PCN2040
Description: Conversion to Copper Bond Wire on Selected Discrete Products
Date of Issue: 03/05/2011 00:00:00
PCN Number: 2061
Description: Additional Assembly & Test Site for SOT-23
Date of Issue: 19/08/2011 00:00:00
PCN Number: PCN_2108
Description: Conversion to Copper Bond Wire
Date of Issue: 08/04/2013 00:00:00
POA
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