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STM32F217IGH6

STMICROELECTRONICS

LQFP176 ETHERNET + U MCU

STM32F217IGH6
Image is for illustrative purposes only. Please refer to product data sheet.

Availability

Stock 2016
Reserved Stock 0
Stock Due Date Date next shipment is due, this may not be for the full quantity shown below -
Total Stock Due 0
Total Reserved Stock Due 0
Supplier Lead Time (wk)
(See Lead Time Forecast)
16
Standard Pack Qty non-stocked items may be subject to a higher supplier minimum order quantity 168
Minimum Order Qty non-stocked items may be subject to a higher supplier minimum order quantity 1
Order Multiple 1
Date Code (YYWW)2316+
Package Type: Tray
RoHS: RoHS Yes
Moisture Sensitive
Tariff Code: 8542319000
ECCN: 5A002A4

Specification

›
A/D Converters24 x 12 bit
ArchitectureARM Cortex-M3
BrandSTMICROELECTRONICS
Case or Package TypeUFBGA176
Clock / Speed120 MHz
Core Size32 bit
D/A Converters2 x 12 bit
Inputs / Outputs140
InterfaceCAN, I2C, IrDA, SPI, USART, USB
Internal OscillatorYes
Memory TypeFLASH
Operating Temperature-40°C to +85°C
Program Memory1M x 8
RAM Size132K x 8
Supply Voltage1.8V to 3.6V
The specification data is supplied for search purposes only. Please refer to the product data sheet for full technical details

PCN PTN

›
PCN (Product Change Notification)
PCN Number: PIL MMS-MIC_12_7428
Description: Additional EWS site for STM8 and STM32 devices - Standard products
Date of Issue: 14/08/2012 00:00:00		PCN1
PCN Number: st_pcn_mms-mic_14_8385
Description: UFBGA Transfer back-end site from Amkor ATK (Korea) to Amkor ATP (Philippines) & Features improvements.
Date of Issue: 10/07/2014 00:00:00		PCN1
PCN Number: PIL MMS-MIC_13_8156
Description: STM32F2xx EMI characteristics update
Date of Issue: 16/10/2013 00:00:00		PCN1
PCN Number: st_PCN 10333
Description: TSMC (Taiwan) additional source for STM32F209 1MB & STM32F46 1MB products in M10/90nm technology
Date of Issue: 24/11/2017 00:00:00		PCN1
PCN Number: PCNSTM4199
Description: qualification of a second source substrate supplier
Date of Issue: 20/08/2023 00:00:00		PCN1
PCN Number: PCNSTM15246
Description: Marking Update
Date of Issue: 09/06/2025 00:00:00		PCN1
PCN Number: ST_PCN MMS-MIC_14_8461
Description: Low-speed external oscillator improvement
Date of Issue: 01/07/2014 00:00:00		PCN1
PCN Number: ST-PCN-12802 Markings 2122
Description: Change of Markings
Date of Issue: 31/05/2021 00:00:00		PCN1
PCN Number: PCN_PIL MMS-MIC_12_7264_11/05/2012
Description: Decrease Low Speed Oscillator consumption for low power applications
Date of Issue: 11/05/2012 00:00:00		PCN1PCN2
PCN Number: ST-MDG-21-12542-Die Cast Change 2108
Description: Die Cast Change
Date of Issue: 23/02/2021 00:00:00		PCN1
PCN Number: PCNSTM2414374
Description: copper palladium bonding wire introduction
Date of Issue: 24/09/2024 00:00:00		PCN1
PCN Number: st_PCN CRP_16_9871
Description: Standardization of Inner Customized Label Size
Date of Issue: 28/07/2016 00:00:00		PCN1
PCN Number: PCNSTM2415095
Description: Enhanced traceability with 2D marking
Date of Issue: 04/12/2024 00:00:00		PCN1
PCN Number: PCNSTM2515422
Description: ASE KaoHsiung (Taiwan) additional source
Date of Issue: 16/09/2025 00:00:00		PCN1
PCN Number: PCN 7747
Description: ST Crolles Wafer Fab additional source in 12" wafers
Date of Issue: 18/03/2013 00:00:00		PCN1
PCN Number: st_PCN MDG_19_10690
Description: ASE Kaohsiung (Taiwan) additional source for UFBGA 5X5 7x7 10x10 package products
Date of Issue: 15/03/2019 00:00:00		PCN1PCN2
PCN Number: st_PCN MMS_15_9045
Description: ST Muar (Malaysia) additional source - UFBGA7x7 and UFBGA10x10 products
Date of Issue: 21/12/2015 00:00:00		PCN1PCN2
PCN Number: st_PCN CRP_20_12482
Description: MBB (Material Barrier Bag) : extend print out warning message on shelf life
Date of Issue: 21/01/2021 00:00:00		PCN1PCN2
PCN Number: ST-PCN12791 Die 2128
Description: Die Redesign
Date of Issue: 16/07/2021 00:00:00		PCN1
PCN Number: PIL_MMS-MIC/12/7220_13/04/20121
Description: Decrease Low Speed Oscillator consumption for low power applications
Date of Issue: 13/04/2012 00:00:00		PCN1PCN2
PCN Number: MDG/21/12916
Description: SE Kaohsiung (Taiwan) xFBGA package Bonding Wire procurement flexibility
Date of Issue: 13/12/2021 00:00:00		PCN1PCN2
PCN Number: PIL MMS-MIC_12_7477
Description: Current consumption Reduction in VBAT mode
Date of Issue: 11/09/2012 00:00:00		PCN1PCN2

Price (Each)

Special price!
QtyPriceSpecial Buy Price
1£9.77000£7.93284
11£9.37000£7.93284
101£9.00000£7.93284
251£8.77000£7.93284
501+£8.55000£7.93284
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