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STM32F103RDT6

STMICROELECTRONICS

LQFP64 CORTEX M3 384K FLASH

STM32F103RDT6
Image is for illustrative purposes only. Please refer to product data sheet.

Availability

Stock 621
Reserved Stock 0
Stock Due Date Date next shipment is due, this may not be for the full quantity shown below -
Total Stock Due 0
Total Reserved Stock Due 0
Supplier Lead Time (wk) 12
Standard Pack Qty non-stocked items may be subject to a higher supplier minimum order quantity 160
Minimum Order Qty non-stocked items may be subject to a higher supplier minimum order quantity 1
Order Multiple 1
Date Code2308+
Package Type: Tray
Moisture Sensitive
Tariff Code: 8542319000
ECCN: 3A991A2

Specification

A/D Converters16 x 12 bit
ArchitectureARM Cortex-M3
BrandSTMICROELECTRONICS
Case or Package TypeLQFP64
Clock / Speed72 MHz
Core Size32 bit
D/A Converters2 x 12 bit
Inputs / Outputs51
InterfaceCAN, I2C, IrDA, LIN, SPI, USART, USB
Internal OscillatorYes
Memory TypeFLASH
Operating Temperature-40°C to +85°C
Program Memory384K x 8
RAM Size64K x 8
Supply Voltage2V to 3.6V
The specification data is supplied for search purposes only. Please refer to the product data sheet for full technical details

PCN PTN

PCN (Product Change Notification)
PCN Number: MMS-MIC/09/4944
Description: Qualification of ST Muar (Malaysia) TQFP 10x10 assembly
Date of Issue: 18/09/2009 00:00:00
PCN1PCN2
PCN Number: MMS-MIC/10/5756
Description: Qualification of a new wafer fab for STM32F10x high & small density devices
Date of Issue: 16/07/2010 00:00:00
PCN1PCN2
PCN Number: PCN MMS-MIC_12_7248
Description: Package assembly material change
Date of Issue: 30/04/2012 00:00:00
PCN1PCN2
PCN Number: PIL MMS-MIC_12_7428
Description: Additional EWS site for STM8 and STM32 devices - Standard products
Date of Issue: 14/08/2012 00:00:00
PCN1
PCN Number: PCN_7759
Description: New die revision
Date of Issue: 26/03/2013 00:00:00
PCN1
PCN Number: PIL MMS-MIC_13_7803
Description: Addendum PIL7759 - New die revision for STM32F10x (128K, 512K) products
Date of Issue: 26/04/2013 00:00:00
PCN1
PCN Number: st_PCN MMS-MIC_14_8685
Description: Conversion to High Density Matrix Leadframe
Date of Issue: 03/10/2014 00:00:00
PCN1
PCN Number: st_PCN_MMS_15_9108
Description: Amkor ATP (Philippines) additional back-end source
Date of Issue: 25/06/2015 00:00:00
PCN1PCN2
PCN Number: st_PCN_MDG_17_9976
Description: Transfer assembly plant from Stats ChipPAC Shanghai China (SCC) to Stats ChipPAC Jiangyin China (JSCC)
Date of Issue: 03/03/2017 00:00:00
PCN1PCN2
PCN Number: st_PCN MDG_18_10548
Description: ASE Kaohsiung (Taiwan) additional source for LQFP 7x7 & LQFP 10x10 extended listed products
Date of Issue: 14/12/2018 00:00:00
PCN1PCN2
PCN Number: st_PCN MDG_19_11628
Description: ST Muar (Malaysia) HD line capacity extension STM8 & STM32 LQFP 10x10 64L additional products
Date of Issue: 05/07/2019 00:00:00
PCN1PCN2
PCN Number: st_PCN MDG_20_12050
Description: JSCC capacity increase - for listed products
Date of Issue: 13/03/2020 00:00:00
PCN1PCN2
PCN Number: st_PCN CRP_20_12482
Description: MBB (Material Barrier Bag) : extend print out warning message on shelf life
Date of Issue: 21/01/2021 00:00:00
PCN1PCN2
PCN Number: MDG/22/13318
Description: ST MUAR Enhanced traceability with 2D marking
Date of Issue: 03/11/2022 00:00:00
PCN1PCN2

Price (Each)

QtyPrice
1£4.72000
11£4.53000
101£4.35000
251£4.24000
501+£4.21000

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