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ST1S10PUR

STMICROELECTRONICS

3A STEP DOWN SYNC. RECT. W/IN

ST1S10PUR
Image is for illustrative purposes only. Please refer to product data sheet.

Availability

Stock 0
Reserved Stock 0
Stock Due Date Date next shipment is due, this may not be for the full quantity shown below -
Total Stock Due 0
Total Reserved Stock Due 0
Supplier Lead Time (wk) 16
Standard Pack Qty non-stocked items may be subject to a higher supplier minimum order quantity 4500
Minimum Order Qty non-stocked items may be subject to a higher supplier minimum order quantity 4500
Order Multiple 4500
Package Type: Tape & Reel
Tariff Code: 8542399000
ECCN: NLR

Specification

BrandSTMICROELECTRONICS
Case or Package TypeDFN8
ModeSynchronous
Mounting TypeSurface Mount
No. of Outputs1
Operating Temperature-25°C to +125°C
Output Current3 A
Output Voltage0.8V to 15.3V
Supply Voltage2.5V - 18V
Switching Frequency900 kHz
TopologyBuck
The specification data is supplied for search purposes only. Please refer to the product data sheet for full technical details

PCN PTN

PCN (Product Change Notification)
PCN Number: st_CRP_16_9465
Description: Moisture Barrier Bag change
Date of Issue: 09/05/2016 00:00:00
PCN1PCN2
PCN Number: PCNSTM2515292
Description: Additional 2D in ST Standard Inner Bulk Label
Date of Issue: 18/07/2025 00:00:00
PCN1
PCN Number: APM/07/3016
Description: NEW B/E LOCATION FOR VFDFPN/VFQFPN Packages for IMS
Date of Issue: 30/11/2007 00:00:00
PCN1PCN2
PCN Number: st_PCN AMS_19_11931
Description: Introduction of a Rough Lead frame for VFDFPN 4x4 8L package assembled in Carsem Malaysia
Date of Issue: 03/01/2020 00:00:00
PCN1PCN2
PCN Number: st_PCN CRP_16_9871
Description: Standardization of Inner Customized Label Size
Date of Issue: 28/07/2016 00:00:00
PCN1
PCN Number: st_PCN IPG-IPC_14_8692
Description: Micro Leadframe Package conversion to High Density Leadframe in CARSEM sites
Date of Issue: 03/10/2014 00:00:00

Price (Each)

QtyPrice
4500£1.03400
9000£0.91700
13500+£0.81300
Looking for higher volume pricing? Volume enquiries

Resources

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