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STW26NM50

STMICROELECTRONICS

MDMOS 500 V0.12OHM

STW26NM50
Image is for illustrative purposes only. Please refer to product data sheet.

Availability

Free Stock 1
Reserved Stock 0
Stock Due Date -
Total Stock Due 0
Total Reserved Stock Due 0
Supplier Lead Time (wk) 18
Standard Pack Qty non-stocked items may be subject to a higher supplier minimum order quantity 30
Minimum Order Qty non-stocked items may be subject to a higher supplier minimum order quantity 1
Order Multiple 1
Package Type: Tube
Tariff Code: 8541290000

Specification

BrandSTMICROELECTRONICS
Continuous Drain Current30 A
Drain-Source Voltage500 V
Gate-Source V(th)5 V
Input Capacitance3000 pF
Mounting TypeThrough Hole
Power Dissipation110 W
Rds (on)120 mohm
TypeN-Channel
Case or Package TypeTO247
The specification data is supplied for search purposes only. Please refer to the product data sheet for full technical details

PCN PTN

PCN (Product Change Notification)
PCN Number: MPA-PMT/06/1947
Description: New Subcontractor location (PSI-Philippines) for TO-247
Date of Issue: 27/07/2006 00:00:00
PCN1PCN2
PCN Number: APM/07/2904
Description: New Molding compound for TO- 247
Date of Issue: 25/10/2007 00:00:00
PCN1PCN2
PCN Number: APM-PWR/10/5868
Description: Package assembly material change
Date of Issue: 02/09/2010 00:00:00
PCN1PCN2
PCN Number: ST_PCN IPG_14_8475
Description: Package assembly location change
Date of Issue: 16/05/2014 00:00:00
PCN1
PCN Number: st_pcn_IPG-PWR_14_8674
Description: Packaging Back-End Capacity Extension - Nantong Fujitsu Microelectronics (China)
Date of Issue: 02/09/2014 00:00:00
PCN1
PCN Number: st_PCN CRP_19_11478
Description: Replacement of current mold compounds with alternative material.
Date of Issue: 12/04/2019 00:00:00
PCN1PCN2
PCN Number: st_PCN ADG_19_11736
Description: New Molding Compound Shenzhen (China) - Bouskoura (Morocco) - Tongfu Microelectronics (China) - INDUSTRIAL
Date of Issue: 26/09/2019 00:00:00
PCN1PCN2

Price (Each)

QtyPrice
1£2.11000
31£2.08000
61+£2.04000

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