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Semiconductor Discretes
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Transistors
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MOSFET's
STW11NK100Z
STMICROELECTRONICS
TO247 NMOS 8A 1000V 1.1R 230W
Image is for illustrative purposes only. Please refer to product data sheet.
Availability
Stock
600
Reserved Stock
0
Stock Due Date
Date next shipment is due, this may not be for the full quantity shown below
-
Total Stock Due
0
Total Reserved Stock Due
0
Supplier Lead Time (wk)
(See Lead Time Forecast)
16
Standard Pack Qty
non-stocked items may be subject to a higher supplier minimum order quantity
30
Minimum Order Qty
non-stocked items may be subject to a higher supplier minimum order quantity
1
Order Multiple
1
Date Code (YYWW)
2513+
Package Type: Tube
RoHS:
Tariff Code: 8541290000
ECCN: NLR
Specification
›
Brand
STMICROELECTRONICS
Continuous Drain Current
8.3 A
Drain-Source Voltage
1000 V
Gate-Source V(th)
4.5 V
Input Capacitance
3500 pF
Mounting Type
Through Hole
Power Dissipation
70 W
Rds (on)
1.38 ohm
Type
N-Channel
Case or Package Type
TO247
The specification data is supplied for search purposes only. Please refer to the product data sheet for full technical details
PCN PTN
›
PCN (Product Change Notification)
PCN Number: st_pcn_IPG-PWR_14_8674
Description: Packaging Back-End Capacity Extension - Nantong Fujitsu Microelectronics (China)
Date of Issue: 02/09/2014 00:00:00
PCN Number: APM/07/2904
Description: New Molding compound for TO- 247
Date of Issue: 25/10/2007 00:00:00
PCN Number: st_PCN CRP_19_11361
Description: LAX Hub move preparation
Date of Issue: 01/03/2019 00:00:00
PCN Number: MPA-PMT/06/1947
Description: New Subcontractor location (PSI-Philippines) for TO-247
Date of Issue: 27/07/2006 00:00:00
PCN Number: ST_PCN IPG_14_8475
Description: Package assembly location change
Date of Issue: 16/05/2014 00:00:00
PCN Number: st_PCN CRP_19_11478
Description: Replacement of current mold compounds with alternative material.
Date of Issue: 12/04/2019 00:00:00
PCN Number: APM-PWR/10/5868
Description: Package assembly material change
Date of Issue: 02/09/2010 00:00:00
PCN Number: st_PCN ADG_19_11736
Description: New Molding Compound Shenzhen (China) - Bouskoura (Morocco) - Tongfu Microelectronics (China) - INDUSTRIAL
Date of Issue: 26/09/2019 00:00:00
Price (Each)
Qty
Price
1
£1.42400
31
£1.30600
61
£1.24300
91
£1.16900
121+
£1.11900
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