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STGW20NC60VD

STMICROELECTRONICS

IGBT 30A (@100'C) 600V

Image is for illustrative purposes only. Please refer to product data sheet.

Availability

Stock	600
Reserved Stock	0
Stock Due Date Date next shipment is due, this may not be for the full quantity shown below	-
Total Stock Due	0
Total Reserved Stock Due	0
Supplier Lead Time (wk) (See Lead Time Forecast)	16
Standard Pack Qty non-stocked items may be subject to a higher supplier minimum order quantity	30
Minimum Order Qty non-stocked items may be subject to a higher supplier minimum order quantity	1
Order Multiple	1
Date Code (YYWW)	2522+

Package Type: Tube

RoHS:

Tariff Code: 8541290000

ECCN: NLR

Specification

›

Brand	STMICROELECTRONICS
Collector Current	60 A
Collector-Emitter V(br)	600 V
Collector-Emitter V(on)	2.5 V
Mounting Type	Through Hole
Power	200 W
Case or Package Type	TO247

The specification data is supplied for search purposes only. Please refer to the product data sheet for full technical details

PCN PTN

›

PCN (Product Change Notification)
PCN Number: PCNSTM2515607 Description: Qualification of SINGAPORE as new EWS Location. Date of Issue: 25/07/2025 00:00:00
PCN Number: APM-PWR/10/5868 Description: Package assembly material change Date of Issue: 02/09/2010 00:00:00
PCN Number: st_PCN CRP_16_9871 Description: Standardization of Inner Customized Label Size Date of Issue: 28/07/2016 00:00:00
PCN Number: st_pcn_IPG-PWR_14_8674 Description: Packaging Back-End Capacity Extension - Nantong Fujitsu Microelectronics (China) Date of Issue: 02/09/2014 00:00:00
PCN Number: st_PCN CRP_19_11478 Description: Replacement of current mold compounds with alternative material. Date of Issue: 12/04/2019 00:00:00
PCN Number: APM-PWR/07/2475 Description: NEW FRONT END LOCATION FOR IGBT POWER TRANSISTORS Date of Issue: 11/05/2007 00:00:00
PCN Number: APM/07/2904 Description: New Molding compound for TO- 247 Date of Issue: 25/10/2007 00:00:00
PCN Number: ST_PCN IPG_14_8475 Description: Package assembly location change Date of Issue: 16/05/2014 00:00:00
PCN Number: st_PCN ADG_19_11736 Description: New Molding Compound Shenzhen (China) - Bouskoura (Morocco) - Tongfu Microelectronics (China) - INDUSTRIAL Date of Issue: 26/09/2019 00:00:00

Price (Each)

Qty	Price
1	£1.26600
31	£1.12300
61+	£0.99500

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Anglia Live

STGW20NC60VD

STMICROELECTRONICS

IGBT 30A (@100'C) 600V

Availability

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PCN PTN

Price (Each)

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