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STM32G081RBT3

STMICROELECTRONICS

LQFP64 MAIN ACC LINE COR-M0+

STM32G081RBT3
Image is for illustrative purposes only. Please refer to product data sheet.

Availability

Stock 0
Reserved Stock 0
Stock Due Date Date next shipment is due, this may not be for the full quantity shown below -
Total Stock Due 0
Total Reserved Stock Due 0
Supplier Lead Time (wk) 16
Standard Pack Qty non-stocked items may be subject to a higher supplier minimum order quantity 160
Minimum Order Qty non-stocked items may be subject to a higher supplier minimum order quantity 160
Order Multiple 160
Package Type: Tray IC
Moisture Sensitive
Tariff Code: 8542319000
ECCN: 5A992C

Specification

BrandSTMICROELECTRONICS
The specification data is supplied for search purposes only. Please refer to the product data sheet for full technical details

PCN PTN

PCN (Product Change Notification)
PCN Number: MDG/22/13388
Description: ASE Kaohsiung (Taiwan) LQFP7x7 and LQFP10x10 package capacity increase
Date of Issue: 01/05/2022 00:00:00
PCN1PCN2
PCN Number: MDG/22/13640
Description: STM32G070x, STM32G071x and STM32G081x - product enhancement
Date of Issue: 24/11/2022 00:00:00
PCN1PCN2
PCN Number: PCNSTM1486407
Description: Change of factory
Date of Issue: 15/07/2024 00:00:00
PCN1
PCN Number: MDG/21/12853
Description: STM32G0 128K/512K, STM32G03 64K & STM32G05 64K - Datasheets enhancement
Date of Issue: 01/09/2021 00:00:00
PCN1PCN2
PCN Number: PCNSTM15228
Description: STM32G071/81x - Microcontroller products - BootLoader enhancement
Date of Issue: 15/04/2025 00:00:00
PCN1
PCN Number: st_PCN_MDG_23_13841
Description: Copper palladium bonding wire introduction
Date of Issue: 28/02/2023 00:00:00
PCN1PCN2
PCN Number: PCNSTM15246
Description: Marking Update
Date of Issue: 09/06/2025 00:00:00
PCN1
PCN Number: PCNSTM1436304
Description: palladium bonding wire introduction
Date of Issue: 12/04/2024 00:00:00
PCN1

Price (Each)

QtyPrice
160£1.84000
320£1.77000
480£1.70000
640£1.65000
800+£1.61000
Looking for higher volume pricing? Volume enquiries

Resources

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