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STM32F722IEK6

STMICROELECTRONICS

UFBGA176 512KB CORTEX-M7 MCU

STM32F722IEK6
Image is for illustrative purposes only. Please refer to product data sheet.

Availability

Stock 0
Reserved Stock 0
Stock Due Date Date next shipment is due, this may not be for the full quantity shown below -
Total Stock Due 0
Total Reserved Stock Due 0
Supplier Lead Time (wk) 12
Standard Pack Qty non-stocked items may be subject to a higher supplier minimum order quantity 168
Minimum Order Qty non-stocked items may be subject to a higher supplier minimum order quantity 1
Order Multiple 1
Package Type: Tray IC
Moisture Sensitive
Tariff Code: 8542319000
ECCN: 3A991A2

Specification

ArchitectureARM Cortex-M7
BrandSTMICROELECTRONICS
Case or Package TypeUFBGA176
Core Size32 bit
Inputs / Outputs140
Memory TypeFLASH
Program Memory512K x 8
RAM Size256K x 8
Supply Voltage1.7V to 3.6V
The specification data is supplied for search purposes only. Please refer to the product data sheet for full technical details

PCN PTN

PCN (Product Change Notification)
PCN Number: st_PCN MDG_19_10816
Description: TSMC (Taiwan) additional source for STM32F4 & STM32F7 listed products in M10/90nm technology
Date of Issue: 15/02/2019 00:00:00
PCN1PCN2
PCN Number: st_PCN MDG_19_10690
Description: ASE Kaohsiung (Taiwan) additional source for UFBGA 5X5 7x7 10x10 package products
Date of Issue: 15/03/2019 00:00:00
PCN1PCN2
PCN Number: st_PCN CRP_20_12482
Description: MBB (Material Barrier Bag) : extend print out warning message on shelf life
Date of Issue: 21/01/2021 00:00:00
PCN1PCN2
PCN Number: ST-MDG-21-12542-Die Cast Change 2108
Description: Die Cast Change
Date of Issue: 23/02/2021 00:00:00
PCN1
PCN Number: ST-PCN-12802 Markings 2122
Description: Change of Markings
Date of Issue: 31/05/2021 00:00:00
PCN1
PCN Number: MDG/21/12916
Description: SE Kaohsiung (Taiwan) xFBGA package Bonding Wire procurement flexibility
Date of Issue: 13/12/2021 00:00:00
PCN1PCN2

Price (Each)

QtyPrice
1£8.31000
169£7.97000
337£7.66000
505£7.46000
673+£7.41000

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