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STM32F401VDH6

STMICROELECTRONICS

UFBGA100 384K FLASH CORTEX MCU

Image is for illustrative purposes only. Please refer to product data sheet.

Availability

Stock	0
Reserved Stock	0
Stock Due Date Date next shipment is due, this may not be for the full quantity shown below	-
Total Stock Due	0
Total Reserved Stock Due	0
Supplier Lead Time (wk) (See Lead Time Forecast)	16
Standard Pack Qty non-stocked items may be subject to a higher supplier minimum order quantity	416
Minimum Order Qty non-stocked items may be subject to a higher supplier minimum order quantity	416
Order Multiple	416

RoHS:

Moisture Sensitive

Tariff Code: 8542319000

ECCN: 3A991A2

Specification

›

Brand

STMICROELECTRONICS

The specification data is supplied for search purposes only. Please refer to the product data sheet for full technical details

PCN PTN

›

PCN (Product Change Notification)
PCN Number: st_PCN MMS_15_9045 Description: ST Muar (Malaysia) additional source - UFBGA7x7 and UFBGA10x10 products Date of Issue: 21/12/2015 00:00:00
PCN Number: ST-PCN-12802 Markings 2122 Description: Change of Markings Date of Issue: 31/05/2021 00:00:00
PCN Number: PCNSTM15246 Description: Marking Update Date of Issue: 09/06/2025 00:00:00
PCN Number: st_PCN CRP_20_12482 Description: MBB (Material Barrier Bag) : extend print out warning message on shelf life Date of Issue: 21/01/2021 00:00:00
PCN Number: ST-MDG-21-12542-Die Cast Change 2108 Description: Die Cast Change Date of Issue: 23/02/2021 00:00:00
PCN Number: PCNSTM2414374 Description: copper palladium bonding wire introduction Date of Issue: 24/09/2024 00:00:00
PCN Number: st_PCN MDG_19_10690 Description: ASE Kaohsiung (Taiwan) additional source for UFBGA 5X5 7x7 10x10 package products Date of Issue: 15/03/2019 00:00:00
PCN Number: PCNSTM2415095 Description: Enhanced traceability with 2D marking Date of Issue: 04/12/2024 00:00:00
PCN Number: st_PCN MDG_18_10671 Description: TSMC (Taiwan) additional source for STM32F4 products in M10/90nm technology Date of Issue: 15/06/2018 00:00:00
PCN Number: MDG/21/12916 Description: SE Kaohsiung (Taiwan) xFBGA package Bonding Wire procurement flexibility Date of Issue: 13/12/2021 00:00:00

Price (Each)

Qty	Price
416	£3.09000
832	£2.96000
1248	£2.84000
1664	£2.77000
2080+	£2.70000

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STM32F401VDH6

STMICROELECTRONICS

UFBGA100 384K FLASH CORTEX MCU

Availability

Specification

PCN PTN

Price (Each)

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