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STGP10H60DF

STMICROELECTRONICS

TO220AB IGBT 10A @100C 600V TR

STGP10H60DF
Image is for illustrative purposes only. Please refer to product data sheet.

Availability

Stock 0
Reserved Stock 0
Stock Due Date Date next shipment is due, this may not be for the full quantity shown below -
Total Stock Due 0
Total Reserved Stock Due 0
Supplier Lead Time (wk) 16
Standard Pack Qty non-stocked items may be subject to a higher supplier minimum order quantity 50
Minimum Order Qty non-stocked items may be subject to a higher supplier minimum order quantity 50
Order Multiple 50
Tariff Code: 8541290000
ECCN: NLR

Specification

BrandSTMICROELECTRONICS
The specification data is supplied for search purposes only. Please refer to the product data sheet for full technical details

PCN PTN

PCN (Product Change Notification)
PCN Number: st_PCN CRP_19_11478
Description: Replacement of current mold compounds with alternative material.
Date of Issue: 12/04/2019 00:00:00
PCN1PCN2
PCN Number: PCNSTM2515607
Description: Qualification of SINGAPORE as new EWS Location.
Date of Issue: 25/07/2025 00:00:00
PCN1
PCN Number: st_PCN ADG_18_11145
Description: IGBT Trench Technology 8” Wafer Front-end Capacity Extension - Ang Mo Kio (S'Pore) - INDUSTRIAL
Date of Issue: 19/10/2018 00:00:00
PCN1PCN2
PCN Number: st_PCN ADG_18_11251
Description: TO-220 Plating Process Capacity Extension - Dongguan Syundai (China) - INDUSTRIAL
Date of Issue: 14/12/2018 00:00:00
PCN1PCN2
PCN Number: ADG/21/13069
Description: IGBT/IPM TFS Technology Front End Expansion - External Samsung Foundr
Date of Issue: 22/10/2021 00:00:00
PCN1PCN2
PCN Number: st_PCN ADG_19_11736
Description: New Molding Compound Shenzhen (China) - Bouskoura (Morocco) - Tongfu Microelectronics (China) - INDUSTRIAL
Date of Issue: 26/09/2019 00:00:00
PCN1PCN2

Price (Each)

QtyPrice
50£0.70700
100£0.62700
150+£0.55500
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