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Events / Memory Technology 2021 and beyond
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Memory Technology 2021 and beyond

Analog Devices SHARC+ DSP Technology for Industrial, Consumer and Automotive Audio Applications

17th June 2021, 14:00

Hosting Platform: Zoom

On 17th June, Anglia, supported by Winbond Electronics Corporation and Everspin Technologies will provide a webinar to discuss the latest technical features and roadmaps of specialty volatile and non-volatile memory products.

Winbond is a specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavours to provide its customers with total memory solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash, Specialty DRAM and Mobile DRAM. The Company is the only one in Taiwan with the ability to develop DRAM and FLASH products in-house.

This webinar will update attendees on QSPI NAND and SPI NOR Flash along with their authentication products.

Headquartered in Chandler, Arizona, Everspin Technologies, Inc. is the worldwide leader in designing, manufacturing, and commercially shipping discrete and embedded Magnetoresistive RAM (MRAM) and Spin-transfer Torque MRAM (STT-MRAM) into markets and applications where data persistence and integrity, low latency, and security are paramount.

The webinar will cover the technical benefits and features of MRAM technology for applications such as medical, factory automation, IoT and smart.

The event will give the opportunity to ask questions to the experts on memory products.

Agenda

  • 14.00 Introduction, Andrew Pockson, Divisional Engineering Manager, Anglia
  • 14.05 Winbond introduction and insight on FLASH and DDR products,
    Anil Gupta, Technical Executive & Christian Bangart, Senior Technology Manager, Winbond
  • 14:45 Everspin introduction and insight into the benefits of MRAM,
    Peter Schubert, Sr. Director of Sales & Paolo Schiappacasse, EMEA Technical Field Specialist
  • 15.15 Q & A / Close

 

 

Presenter: Christian Bangart

Job Title: Senior Technology Manager, Winbond

Presenter Bio: Christian Bangert has held various positions in Sales and Marketing in the past 20+ years in the industry. His main focus in Winbond is business development into the „mass market“, by supporting Distributors in building Winbond business in its many innovative, mid-size companies across Europe.

 

Presenter: Anil Gupta

Job Title: Technical Executive, Winbond USA

Presenter Bio:Anil Gupta has 35 years’ experience as a pioneer in Flash memories, with 2 dozen patents and publications. As Technical Executive at Winbond, he promotes Flash products to automotive customers in Europe and Israel. He has written papers for eetimes and presented at Electronica Munich. He has successfully driven adoption of QspiNAND™ in multiple automotive applications. While at Atmel during 1995~2007, he developed and led Industries first commercial SPI NOR product line.

 
 

Presenter: Peter Schubert

Job Title: Sr. Director of Sales, Everspin

Presenter Bio:Management of Sales Organizations supporting OEM and Distribution Business in Industrial, Automotive, Aerospace and Consumer market segments Various EMEA Sales Positions in the Semiconductor Industry (Mitsubishi, GE, Hitachi, Harris/Intersil, Samsung, Everspin).

 
 

Presenter: Paolo Schiappacasse

Job Title: EMEA Field Technical Specialist, Everspin

Presenter Bio:Technical Support and Business Development for all European Countries to introduce company's competencies and standard/customs products
Customer's needs analysis and technical proposals Strategic Accounts Support
Application Notes and Collaterals (White papers and technical documentation creation) General aptitude for problem solving and using technology to improve processes.

 

 

 

 

 

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