TDK Corporation has developed a new multilayer diplexer in case size IEC 1005 for the implementation of 2.4 GHz/5 GHz band WLAN in smartphones and other mobile devices.

With its miniature dimensions of only 1.0 mm x 0.5 mm x 0.4 mm the DPX105950DT-6010B1 diplexer is the smallest in the industry*. Thus, the volume of the new component is more than 60 percent smaller than existing 1608 diplexers.

In spite of the significant size reduction, the new diplexer provides equal or even better insertion loss and attenuation performance. For example, the maximum low band insertion loss at 2.4 to 2.5 GHz is just 0.5 dB, while the high band attenuation in the same frequency range is at least 25 dB. Mass production of the new diplexer has started.

Diplexers are electronic components used in the antenna input/output section to divide or combine two different frequency bands. The new product features a combination of layers with different dielectric constants, which are produced using TDK’s co-firing technology.

TDK was able to further miniaturize its diplexer by using even thinner ceramic layers and finer conductor lines. The product is rated for an operating temperature of -40°C to +85°C and is suitable for use in the Bluetooth and WLAN circuitry in mobile devices.

* As of March 2014, according to TDK data

Main applications

 

• WLAN and Bluetooth transmitter-receiver circuitry in smartphones, mobile phones, and other mobile devices and modules

 

Main features and benefits

 

• Volume more than 60 percent smaller than existing products with equal or better performance
• Miniaturized footprint and insertion height enable low-profile designs and module integration

 

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