Toshiba’s e•MMC™ is a family of advanced and highly efficient NAND flash memory with an integrated controller and enhanced memory management features. Based on an interface standardized by JEDEC, Toshiba’s e•MMC™ offers the optimal solution for applications where higher data volume needs to be stored in a cost efficient way. It is fully compliant with the Multimedia Card Association (MMCA) high speed memory interface standard.
Demand continues to grow for large density NAND flash memory chips that can support high resolution video and deliver enhanced storage. This is particularly true in the area of embedded memories with a controller function, which minimize development requirements and ease integration into system designs.
Typically when using a NAND memory solution without an integrated controller chip, processing operations such as the management of bad blocks, error correction code (ECC), logical-physical address conversion, or wear-levelling (averaging out of the number of rewrites) need to be built into the system by the designer. Toshiba's line-up of e•MMC™ NAND flash memory products simplify this design process by integrating a controller chip which handles all of these advanced processing operations and a large-capacity MLC NAND flash memory chip into one package.
Furthermore the integrated controller is developed by Toshiba specifically for each generation of NAND flash memory, therefore any changes in specifications or the sophistication of processing operations which would normally require a design change are rendered practically invisible to the system designer because they are handled directly by the integrated controller. This allows customers to take advantage of the latest generation of NAND flash memory process technologies without the burden of complicated and costly redesign each time.
The range of e•MMC™ NAND flash memory products from Toshiba is available in densities from 4GByte to 64GByte, all devices feature an integrated controller which handles memory management functions including error correction code (ECC), bad block management, wear-levelling and garbage collection.
Toshiba e•MMC™ products feature Multi level cell (MLC) architecture and conform to the latest JEDEC version 4.5 and 5.0 allowing Read Speeds up to 275MB/s and Write Speeds up to 90MB/s. The products also support the JEDEC compliant “Enhanced User Data Area”, also called “Pseudo-SLC”. For applications requiring a part of the memory to perform with higher write/erase cycles than MLC NAND, e•MMC™ provides the option to build a partition which offers “pseudo-SLC“ performance. The normal MLC mode can be changed to the more reliable “pseudo SLC” mode.
The Toshiba e•MMC™ NAND flash memory devices are available in standard (-25°C to +85°C) and extended (-40°C to +85°C) temperature ranges and are supplied in FBGA format packages.
Click on below video to learn how Toshiba are breaking new frontiers in NAND Flash Memory design
Anglia are offering customers FREE e•MMC™ NAND flash memory samples, to register for yours please fill in the form below.
FREE samples for UK and Ireland customers only, subject to availability.
STMicroelectronics are powering the next generation of Industry 4.0 applications with a new vibration-sensing solution optimized to enable smart maintenance of factory equipment. The IIS3DWB is a system-in-package MEMS sensor featuring a 3-axis digital vibration sensor with low noise over an ultra-wide and flat frequency range. The wide bandwidth, low noise, very stable and repeatable sensitivity, together with the capability of operating over an extended temperature range (up to +105 °C), make the device particularly suitable for vibration monitoring in industrial applications.
Power management company Eaton has introduced the C308F Bussmann Series of fast-acting, ceramic tube fuses for intrinsic safety requirements used in hazardous environments such as network barriers and other equipment used in mines, oil drilling structures, gas stations, gas meters, chemical refineries and hazardous material transportation...
Gemalto’s suite of Cinterion® EHS6T 3G Smart Terminals takes M2M simplicity to a whole new level, leveraging Gemalto’s next-generation Java® embedded technology...
Open standards and a huge ecosystem of freely available tools and code were a key ingredient in the growth and success of Java and the wildly creative Java developer community. Gemalto is moving this concept forward for the embedded space with the Cinterion Concept Board...
Gemalto’s Cinterion® EHS6T 3G Smart LAN Terminal takes M2M simplicity to a whole new level, leveraging Gemalto’s next-generation Java® embedded technology, plug-and-play solutions are powered by a five-band HSPA+ baseband engine enabling high-speed, secure wireless TCP/IP connectivity for a variety of industrial applications...
The Cinterion® Connect Shield is an easy-to-use maker board, based on the ELS61-E LTE Cat.1 cellular module, that combines the flexible and widely used Arduino open source platform with Gemalto’s reliable and highly efficient cellular connectivity...
Gemalto, the world leader in digital security, is expanding Industrial IoT connectivity with a significant breakthrough in wireless engineering – the industry's first IoT module to provide global connectivity on 12 LTE bands plus, global 3G and global 2G cellular coverage all from a single device...